Shenzhen Summer Internship Programme

The 2019 Shenzhen Summer Internship Programme has already ended. Details of the programme below are for reference only.

The Shenzhen Summer Internship Programme was organised by Fin Society and sponsored by the HKMA. It is one of the four programmes under the Fintech Career Accelerator Scheme 2.0, which aims to enhance Hong Kong’s fintech talent building capability to meet the growing demand from the industry and to nurture young talents at different stages of their career development.

Programme Structure

Internship at eight leading fintech or techfin firms in Shenzhen, with exclusive events designed for students to experience the fintech ecosystem in Shenzhen.

Stipend Allowance

Nominal allowance was provided by hiring firms. The costs of accommodation and insurance were covered by the HKMA.




16 June to 26 July 2019 (6 weeks) 


HK$5,000 (fully refundable upon completion of the programme with satisfactory attendance)

Shenzhen Summer Internship Programme

Last revision date : 26 August 2019